| 摘要 |
A bonding method and a bonding device for substrates are provided. Nonuniformity of thickness can be eliminated by removing stress caused by bonder. After the substrates (1, 2) are superposed with the bonder (3) therebetween, by enabling one substrate (1) and the other substrate (2) to move in a relative rotation or linear way, the bonder (3) expands between the substrates (1, 2), so that the thickness of the bonder (3) is uniform. |
