发明名称 MANUFACTURING METHOD OF ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method of an electronic component that can manufacture electronic components high in characteristic accuracy with a high yield.SOLUTION: A manufacturing method includes a parameter obtaining process for obtaining a parameter of an electronic component element, a photoresist application process, a photoresist exposure process, and a photoresist development process. The parameter obtaining process obtains a parameter for each section set on a wafer W, and the photoresist exposure process corrects a position of at least one of the wafer W and a photomask 305 in a horizontal direction when the parameter for each section varies beyond a predetermined threshold, thus correcting a position of a pattern exposed to the photoresist in a horizontal direction.SELECTED DRAWING: Figure 2
申请公布号 JP2016048759(A) 申请公布日期 2016.04.07
申请号 JP20140173774 申请日期 2014.08.28
申请人 MURATA MFG CO LTD 发明人 SASAKI HIDEHIKO;HAGI TOSHIO
分类号 H01L21/822;G03F9/00;H01L21/02;H01L21/027;H01L27/04 主分类号 H01L21/822
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