| 发明名称 |
Polyamide Resin, Method for Preparing the Same, and Molded Article Including the Same |
| 摘要 |
A polyamide resin is a polymer of an adipic acid-containing dicarboxylic acid component and an m-xylenediamine-containing diamine component, wherein the polymer includes about 100 ppm or less of phosphorus and about 100 ppm or less of sodium (Na), and has a gel content of about 0.5% or less as measured on a specimen prepared by melting about 10 g of the polymer at about 260° C., maintaining the molten polymer for about 30 minutes, and then cooling the molten polymer to room temperature. The polyamide resin can exhibit excellent heat resistance and can reduce or prevent gel generation upon polymerization or molding. |
| 申请公布号 |
US2016096924(A1) |
申请公布日期 |
2016.04.07 |
| 申请号 |
US201514598506 |
申请日期 |
2015.01.16 |
| 申请人 |
SAMSUNG SDI CO., LTD. |
发明人 |
KIM Jin Kyu;KWON So Young;JIN Young Sub;KIM Joon Sung;SON Su Yeong;LEE Ki Yon;IM Sang Kyun;JUN Suk Min |
| 分类号 |
C08G69/30 |
主分类号 |
C08G69/30 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A polyamide resin being a polymer of an adipic acid-containing dicarboxylic acid component and an m-xylenediamine-containing diamine component,
wherein the polymer comprises about 100 ppm or less of phosphorus and about 100 ppm or less of sodium, and has a gel content of about 0.5% or less, as measured on a specimen prepared by melting about 10 g of the polymer at about 260° C., maintaining the molten polymer for about 30 minutes, and then cooling the molten polymer to room temperature. |
| 地址 |
Yongin-si KR |
