Cooled electronic part enclosure

摘要

A case assembly encloses heat generating electronic components. The case includes first and second housing parts which can be cast from the same mold. Covers are mounted to the housings to form coolant passages. The housing parts include built-in the connecting parts which are coupled together to form additional coolant passages. One of the connecting parts has a lip which sealingly receives an end of another connecting part. The lip is received by a slot adjacent to the other connecting part. The slot communicates with an exterior of the housing.

主权项

1. A case assembly for containing a heat generating electronic component, said case assembly comprising:
a first housing, the first housing comprising a first main body and a hollow first connecting part which is joined to the first main body; a second housing for attaching to the first housing so that the first and second housings form an inner enclosure which surrounds the heat generating electronic component, the second housing comprising a second main body and a hollow second connecting part which is joined to the second main body; a first cover mounted to the first housing; and a second cover mounted to the second housing; a first liquid coolant passage formed between the first housing and the first cover; and a second liquid coolant passage formed between the second housing and the second cover, the first and second connecting parts being coupled together in sealed engagement to form a third coolant passage for a liquid coolant where the third coolant passage communicates the first coolant passage with the second coolant passage.