发明名称 Mechanism for generating a hybrid communication circuitry for facilitating hybrid communication between devices
摘要 A mechanism is described for facilitating hybrid communication between devices according to one embodiment. A method of embodiments, as described herein, includes coupling an inductive coil of a near proximity circuitry with a capacitive pad of a body area circuitry to form a hybrid circuitry, and facilitating, via the hybrid circuitry, the hybrid communication between a plurality of devices.
申请公布号 US9306628(B2) 申请公布日期 2016.04.05
申请号 US201314129948 申请日期 2013.10.01
申请人 Intel Corporation 发明人 Konanur Anand S.;Karacaoglu Ulun;Lee Kwan Ho;Takagi Akihiro
分类号 H04B5/00;H04W4/00;H04L29/06;H04W12/06 主分类号 H04B5/00
代理机构 Blakely, Sokoloff, Taylor & Zafman LLP 代理人 Blakely, Sokoloff, Taylor & Zafman LLP
主权项 1. An apparatus comprising: a near proximity circuitry coupled to a processor further coupled to a memory, the near proximity circuitry including an inductive coil; and a capacitive pad of a body area circuitry, wherein the capacitive pad is coupled to the inductive coil to form a hybrid circuitry to facilitate the hybrid communication, wherein the coupling of the capacitive pad and the inductive coil comprises a parallel coupling and a wraparound coupling, wherein the wraparound coupling includes a single component having the capacitive pad on a first side of the component and the inductive coil on a second side of the component, wherein the first side includes a top side of the component, and a second side includes a bottom side of the component.
地址 Santa Clara CA US