发明名称 |
Mechanism for generating a hybrid communication circuitry for facilitating hybrid communication between devices |
摘要 |
A mechanism is described for facilitating hybrid communication between devices according to one embodiment. A method of embodiments, as described herein, includes coupling an inductive coil of a near proximity circuitry with a capacitive pad of a body area circuitry to form a hybrid circuitry, and facilitating, via the hybrid circuitry, the hybrid communication between a plurality of devices. |
申请公布号 |
US9306628(B2) |
申请公布日期 |
2016.04.05 |
申请号 |
US201314129948 |
申请日期 |
2013.10.01 |
申请人 |
Intel Corporation |
发明人 |
Konanur Anand S.;Karacaoglu Ulun;Lee Kwan Ho;Takagi Akihiro |
分类号 |
H04B5/00;H04W4/00;H04L29/06;H04W12/06 |
主分类号 |
H04B5/00 |
代理机构 |
Blakely, Sokoloff, Taylor & Zafman LLP |
代理人 |
Blakely, Sokoloff, Taylor & Zafman LLP |
主权项 |
1. An apparatus comprising:
a near proximity circuitry coupled to a processor further coupled to a memory, the near proximity circuitry including an inductive coil; and a capacitive pad of a body area circuitry, wherein the capacitive pad is coupled to the inductive coil to form a hybrid circuitry to facilitate the hybrid communication, wherein the coupling of the capacitive pad and the inductive coil comprises a parallel coupling and a wraparound coupling, wherein the wraparound coupling includes a single component having the capacitive pad on a first side of the component and the inductive coil on a second side of the component, wherein the first side includes a top side of the component, and a second side includes a bottom side of the component. |
地址 |
Santa Clara CA US |