SEMICONDUCTOR DEVICE

摘要

Reduction in reliability of a semiconductor device is suppressed. A semiconductor device includes a plurality of metal patterns formed on a ceramic substrate, and a plurality of semiconductor chips mounted on the plurality of metal patterns. Also, the plurality of metal patterns include metal patterns MPH and MPU which face each other. In addition, a region which is provided between these metal patterns MPH and MPU and which is exposed from the plurality of metal patterns extends so as to zigzag along an extending direction of the metal pattern MPH.

主权项

1. A semiconductor device comprising:
a ceramic substrate having a first surface, and a second surface located on an opposite side of the first surface; a plurality of metal patterns formed on the first surface of the ceramic substrate; and a plurality of semiconductor chips mounted on one or some of the plurality of metal patterns, wherein the plurality of metal patterns include:
a first metal pattern which has a first side and on which a plurality of first semiconductor chips among the plurality of semiconductor chips are mounted; anda second metal pattern which has a second side facing the first side of the first metal pattern and which is separated from the first metal pattern, when seen in a plan view, the first side of the first metal pattern includes: a plurality of first convex portions protruding toward the second side of the second metal pattern; and a first concave portion formed between the plurality of first convex portions, when seen in a plan view, the second side of the second metal pattern includes: a second convex portion protruding toward the first side of the first metal pattern; and a plurality of second concave portions formed on both sides of the second convex portion, and the plurality of first convex portions are provided so as to protrude toward the plurality of second concave portions, and the second convex portion is provided so as to protrude toward the first concave portion.