| 发明名称 |
PACKAGES FOR STRESS-SENSITIVE DEVICE DIES |
| 摘要 |
An integrated device package is disclosed. The package includes a substrate comprising a cavity through a top surface of the substrate. A first integrated device die is positioned in the cavity. The first integrated device die includes one or more active components. A second integrated device die is attached to the top surface of the substrate and positioned over the cavity. The second integrated device die covers the cavity. Encapsulant can cover the second integrate device die. |
| 申请公布号 |
US2016090298(A1) |
申请公布日期 |
2016.03.31 |
| 申请号 |
US201414554661 |
申请日期 |
2014.11.26 |
| 申请人 |
ANALOG DEVICES, INC. |
发明人 |
Sengupta Dipak;Saiyed Shafi |
| 分类号 |
B81B7/00;B81C1/00 |
主分类号 |
B81B7/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An integrated device package comprising:
a substrate comprising a cavity through a top surface of the substrate; a first integrated device die positioned in the cavity, the first integrated device die comprising one or more active components; and a second integrated device die attached to the top surface of the substrate and positioned over the cavity, the second integrated device die covering the cavity. |
| 地址 |
Norwood MA US |
