发明名称 |
FLEXIBLE DEVICE AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
According to the present invention, disclosed are a flexible device manufacturing method and a flexible device manufactured by the same. The flexible device manufacturing method comprises: a step of bonding a base film including a conductive layer to a carrier substrate by using a water-soluble photo-curable adhesive; a step of forming a conductive pattern layer by patterning the conductive layer; a step of forming an insulation layer on the conductive pattern layer to provide the flexible device; a step of peeling the flexible device from the carrier substrate by dissolving and removing the water-soluble photo-curable adhesive through aqueous solution. According to the present invention, the manufacturing method allows the base film to be stably bonded to the carrier substrate during a flexible device forming process and the flexible device to be easily peeled from the carrier substrate after the flexible device forming process. |
申请公布号 |
KR20160035262(A) |
申请公布日期 |
2016.03.31 |
申请号 |
KR20140126612 |
申请日期 |
2014.09.23 |
申请人 |
DONGWOO FINE-CHEM CO., LTD. |
发明人 |
CHOI, HAN YOUNG;YOON, HO DONG;LEE, JIN KOO |
分类号 |
H01L51/56;H01L27/32 |
主分类号 |
H01L51/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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