发明名称 FLEXIBLE DEVICE AND METHOD FOR MANUFACTURING THE SAME
摘要 According to the present invention, disclosed are a flexible device manufacturing method and a flexible device manufactured by the same. The flexible device manufacturing method comprises: a step of bonding a base film including a conductive layer to a carrier substrate by using a water-soluble photo-curable adhesive; a step of forming a conductive pattern layer by patterning the conductive layer; a step of forming an insulation layer on the conductive pattern layer to provide the flexible device; a step of peeling the flexible device from the carrier substrate by dissolving and removing the water-soluble photo-curable adhesive through aqueous solution. According to the present invention, the manufacturing method allows the base film to be stably bonded to the carrier substrate during a flexible device forming process and the flexible device to be easily peeled from the carrier substrate after the flexible device forming process.
申请公布号 KR20160035262(A) 申请公布日期 2016.03.31
申请号 KR20140126612 申请日期 2014.09.23
申请人 DONGWOO FINE-CHEM CO., LTD. 发明人 CHOI, HAN YOUNG;YOON, HO DONG;LEE, JIN KOO
分类号 H01L51/56;H01L27/32 主分类号 H01L51/56
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