Enabling package-on-package (PoP) pad surface finishes on bumpless build-up layer (BBUL) package

摘要

A bumpless build-up layer (BBUL) integrated circuit package and method of manufacturing are presented. In some embodiments, the package-on-package (PoP) pads of the BBUL integrated circuit package has a surface finish that can be palladium, nickel-palladium, nickel-gold, nickel-palladium-gold, or palladium-nickel-palladium-gold. In some embodiments, the PoP pad surface finish can be formed using either an electroless or electrolytic process.

主权项

1. A method of manufacturing an integrated circuit (IC) package, the method comprising:
providing a package core with a plurality of package-on-package (PoP) pad locations formed on the package core, wherein the plurality of PoP pad locations are plated with an etch layer of conductive material; plating a sub-surface finish being a group-10 element onto the etch layer at the PoP pad locations; forming at least one build-up layer including interconnects formed therein over a die disposed on the package core and the PoP pad locations; and exposing the PoP pad locations on a side opposing the build-up layer.