| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a grinding method for a plate-like body made of a hard material such as sapphire, SiC or glass, the method never lowering the yield of a device. <P>SOLUTION: The grinding method for the plate-like body in which a reverse surface of the plate-like body having devices formed respectively in regions defined by cutting schedule lines formed in a lattice shape on a top surface is ground to a predetermined thickness includes: a protection tape sticking step of sticking a protection tape on a top surface of the plate-like body; an modified layer forming step of forming a modified layer along one or more of the cutting schedule lines by irradiating the plate-like body with a laser beam which is transmitted through the plate-like body along the cutting schedule lines; and a grinding process of grinding the reverse surface of the plate-like body after the modified layer forming step. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
