| 摘要 |
The present invention relates to a chip electronic component and a board for mounting a chip electronic component. An eternal electrode is extended to at least one of an upper surface, a lower surface, and both side surfaces in a width direction of a main body and disposed to partially overlap an insulation layer disposed on an outer surface of the main body. When a length of the portion overlapping the insulation layer of the portion of the external electrode, extended to at least one of the upper surface, lower surface, and both side surfaces in the width direction of the main body is A and a length of a portion that does not overlap the insulation layer is B, A divided by B can be less than or equal to 0.15. |
