发明名称 METHOD FOR MANUFACTUING SEMICONDUCTOR PACKAGE AND THE SEMICONDUCTOR PACKAGE
摘要 The present invention relates to a semiconductor package and a method for manufacturing the same. According to an embodiment, the method for manufacturing the semiconductor package includes the steps of: preparing a carrier layer including an insulation layer, a first metal layer stacked on an upper surface and a lower surface of the insulation layer sequentially and a solder resist layer, and forming a number of holes for the first metal layer to be exposed on at least one surface of the upper surface and the lower surface of the insulation layer; forming an organic solderability preservative (OSP) layer or a second metal layer on an exposed surface of the first metal layer; attaching a semiconductor die onto the solder resist layer, and connecting the semiconductor die and the OSP layer or the second metal layer electrically using a conductive wire; forming a molding part so that the semiconductor die is covered and the hole is buried; and removing the insulation layer and the first metal layer individually from the solder resist layer onto which the semiconductor die is attached.
申请公布号 KR20160032921(A) 申请公布日期 2016.03.25
申请号 KR20140123675 申请日期 2014.09.17
申请人 AMKOR TECHNOLOGY KOREA, INC. 发明人 KIM, JUNG HWA;KIM, SEUNG MO;CHUNG, JI YOUNG
分类号 H01L23/48 主分类号 H01L23/48
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