发明名称 |
METHOD FOR MANUFACTUING SEMICONDUCTOR PACKAGE AND THE SEMICONDUCTOR PACKAGE |
摘要 |
The present invention relates to a semiconductor package and a method for manufacturing the same. According to an embodiment, the method for manufacturing the semiconductor package includes the steps of: preparing a carrier layer including an insulation layer, a first metal layer stacked on an upper surface and a lower surface of the insulation layer sequentially and a solder resist layer, and forming a number of holes for the first metal layer to be exposed on at least one surface of the upper surface and the lower surface of the insulation layer; forming an organic solderability preservative (OSP) layer or a second metal layer on an exposed surface of the first metal layer; attaching a semiconductor die onto the solder resist layer, and connecting the semiconductor die and the OSP layer or the second metal layer electrically using a conductive wire; forming a molding part so that the semiconductor die is covered and the hole is buried; and removing the insulation layer and the first metal layer individually from the solder resist layer onto which the semiconductor die is attached. |
申请公布号 |
KR20160032921(A) |
申请公布日期 |
2016.03.25 |
申请号 |
KR20140123675 |
申请日期 |
2014.09.17 |
申请人 |
AMKOR TECHNOLOGY KOREA, INC. |
发明人 |
KIM, JUNG HWA;KIM, SEUNG MO;CHUNG, JI YOUNG |
分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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