发明名称 |
SYSTEMS AND METHODS FOR REDUCING LEAKAGE POWER OF A SYSTEM ON CHIP WITH INTEGRATED THERMOELECTRIC COOLING |
摘要 |
Systems, methods, and computer programs are disclosed for reducing leakage power of a system on chip (SoC). One such method comprises monitoring a plurality of temperature differentials across a respective plurality of thermoelectric coolers on a system on chip (SoC). Each of the thermoelectric coolers is dedicated to a corresponding one of a plurality of chip sections on the SoC. The thermoelectric coolers arc controlled based on the plurality of temperature differentials to minimize a sum of a combined power consumption of the plurality of chip sections and the plurality of corresponding dedicated thermoelectric coolers. |
申请公布号 |
WO2016018699(A9) |
申请公布日期 |
2016.03.24 |
申请号 |
WO2015US41629 |
申请日期 |
2015.07.22 |
申请人 |
QUALCOMM INCORPORATED |
发明人 |
MITTAL, RAJAT;PARK, HEE JUN;KANG, YOUNG HOON |
分类号 |
G06F1/20;H01L23/34;H01L23/38;H01L25/065;H01L25/07 |
主分类号 |
G06F1/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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