发明名称 SYSTEMS AND METHODS FOR REDUCING LEAKAGE POWER OF A SYSTEM ON CHIP WITH INTEGRATED THERMOELECTRIC COOLING
摘要 Systems, methods, and computer programs are disclosed for reducing leakage power of a system on chip (SoC). One such method comprises monitoring a plurality of temperature differentials across a respective plurality of thermoelectric coolers on a system on chip (SoC). Each of the thermoelectric coolers is dedicated to a corresponding one of a plurality of chip sections on the SoC. The thermoelectric coolers arc controlled based on the plurality of temperature differentials to minimize a sum of a combined power consumption of the plurality of chip sections and the plurality of corresponding dedicated thermoelectric coolers.
申请公布号 WO2016018699(A9) 申请公布日期 2016.03.24
申请号 WO2015US41629 申请日期 2015.07.22
申请人 QUALCOMM INCORPORATED 发明人 MITTAL, RAJAT;PARK, HEE JUN;KANG, YOUNG HOON
分类号 G06F1/20;H01L23/34;H01L23/38;H01L25/065;H01L25/07 主分类号 G06F1/20
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