发明名称 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
摘要 A semiconductor device according to an embodiment includes a SiC layer, a gate electrode, a gate insulating film provided between the SiC layer and the gate electrode, a first region provided between the SiC layer and the gate insulating film, and a second region provided in the SiC layer. The first region contains at least one element selected from the group consisting of N (nitrogen), P (phosphorus), As (arsenic), Sb (antimony), Sc (scandium), Y (yttrium), La (lanthanum), lanthanoids (Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, and Lu), H (hydrogen), D (deuterium), and F (fluorine). The second region provided adjacent to the first region, and the second region has a higher oxygen concentration than a concentration of the at least one element.
申请公布号 US2016087045(A1) 申请公布日期 2016.03.24
申请号 US201514813619 申请日期 2015.07.30
申请人 Kabushiki Kaisha Toshiba 发明人 SHIMIZU Tatsuo
分类号 H01L29/16;H01L29/51;H01L21/324;H01L21/28;H01L21/321 主分类号 H01L29/16
代理机构 代理人
主权项 1. A semiconductor device comprising: a SiC layer; a gate electrode; a gate insulating film provided between the SiC layer and the gate electrode; a first region provided between the SiC layer and the gate insulating film, the first region containing at least one element selected from the group consisting of N (nitrogen), P (phosphorus), As (arsenic), Sb (antimony), Sc (scandium), Y (yttrium), La (lanthanum), lanthanoids (Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, and Lu), H (hydrogen), D (deuterium), and F (fluorine); and a second region provided in the SiC layer, the second region provided adjacent to the first region, the second region having a higher oxygen concentration than a concentration of the at least one element.
地址 Minato-ku JP