发明名称 SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To easily acquire identification information of a semiconductor device.SOLUTION: A semiconductor device PKG1 includes a plurality of lands LD formed on a mounting surface of a wiring board, in which a land LDc1 and a land LDc2 out of the plurality of lands LD are connected to fuse wiring Wfs. The fuse wiring Wfs is disconnected in the middle of a wiring channel and a fusing part NC1 and a fusing part NC2 which are formed on the disconnected part are opposite to each other and separated from each other. By doing this, identification information of 1 bit capable of being acquired by confirmation fo conduction between the land LDc1 and the land LDc2 is recorded in the fuse wiring Wfs.SELECTED DRAWING: Figure 8
申请公布号 JP2016039266(A) 申请公布日期 2016.03.22
申请号 JP20140161923 申请日期 2014.08.07
申请人 RENESAS ELECTRONICS CORP 发明人 ABEMATSU TAKASHI
分类号 H01L23/12 主分类号 H01L23/12
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