| 摘要 |
A wiring substrate is provided with a support substrate (31), an insulating layer (32), and a wiring layer (33). The support substrate (31) is formed with a hole (34) including an opening portion in one surface of the support substrate (31). The insulating layer (32) is formed on a surface of the support substrate (31) opposite to the one surface thereof including the opening portion. The wiring layer (33) includes a wiring pattern of a predetermined structure on the insulating layer (32). Further, an orthographic projection to be obtained when the wiring pattern is projected on a predetermined surface of the support substrate (31), and an orthographic projection to be obtained when the hole (34) is projected on the predetermined surface of the support substrate (31) include a shared portion. |
