发明名称 PREPREG AND METHOD OF FABRICATING THE SAME, AND PRINTED CIRCUIT BOARD USING PREPREG AND METHOD OF FABRICATING THE SAME
摘要 Provided is a prepreg. The prepreg of the present invention comprises: a core material composed of nanofibers and having the thickness within the range of 10-100 nm; and an upper part insulating layer and a lower part insulating layer respectively provided on an upper surface and a lower surface of the core material which face each other. According to the present invention, as the prepreg comprises the core material composed of the nanofibers, the overall thickness of the prepreg decreases while maintaining mechanical, thermal, and electrical properties.
申请公布号 KR20160019851(A) 申请公布日期 2016.02.22
申请号 KR20150086330 申请日期 2015.06.18
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 LEE, KEUN YONG;KIM, JUN YOUNG;LEE, SA YONG;SHIN, SANG HYUN
分类号 B32B5/02;H05K1/03;H05K1/09;H05K3/38 主分类号 B32B5/02
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