发明名称 ADHESIVE TAPE AND METHOD FOR DISASSEMBLING ELECTRONIC APPARATUS AND ARTICLE
摘要 PROBLEM TO BE SOLVED: To provide an adhesive tape that has extremely superior adhesive strength in a temperature range of 60°C and below and drastically decreases its adhesive strength by application of heat in a short time.SOLUTION: An adhesive tape having a rubber-based adhesive layer is provided, which has such characteristics that: a storage modulus Gat 120°C of an adhesive component included in the adhesive layer is 1.0×10Pa to 2.0×10Pa; a ratio [G/G] of a storage modulus Gat 23°C to the storage modulus G120 is 1 to 20; and the adhesive tape is to be used for adhering two or more adherends, and upon separating the two or more adherends adhered, the tape is heated by use of a halogen lamp.SELECTED DRAWING: Figure 1
申请公布号 JP2016027081(A) 申请公布日期 2016.02.18
申请号 JP20150076813 申请日期 2015.04.03
申请人 DIC CORP 发明人 AKIYAMA SEIJI;MORINO AKINORI
分类号 C09J7/00;B09B3/00;B32B25/04;B32B27/00;C09J7/02;C09J11/06;C09J153/00;C09J153/02 主分类号 C09J7/00
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