PoP structure with electrically insulating material between packages

摘要

A PoP (package-on-package) package includes a bottom package coupled to a top package. Terminals on the top of the bottom package are coupled to terminals on the bottom of the top package with an electrically insulating material located between the upper surface of the bottom package and the lower surface of the top package. The bottom package and the top package are coupled during a process that applies force to bring the packages together while heating the packages.

主权项

1. A method for forming a package-on-package assembly, comprising:
providing an electrically insulating material between an upper surface of a bottom package and a lower surface of a top package, wherein the top package comprises one or more first terminals on the lower surface of the top package and the bottom package comprises one or more second terminals on the upper surface of the bottom package; coupling the top package to the bottom package by aligning and coupling at least some of the first terminals to corresponding second terminals; providing a force to the top package in a direction towards the bottom package while heating the packages and the electrically insulating material to a temperature of at least about 220° C., wherein the electrically insulating material cures during heating of the packages and the electrically insulating material at the temperature of at least about 220° C., and wherein the bottom package comprises partially encapsulating a die in an encapsulant on the upper surface thereof before the coupling the top package to the bottom package.