INTEGRATED MULTI-SENSOR MODULE

摘要

A semiconductor-based multi-sensor module integrates miniature temperature, pressure, and humidity sensors onto a single substrate. Pressure and humidity sensors can be implemented as capacitive thin film sensors, while the temperature sensor is implemented as a precision miniature Wheatstone bridge. Such multi-sensor modules can be used as building blocks in application-specific integrated circuits (ASICs). Furthermore, the multi-sensor module can be built on top of existing circuitry that can be used to process signals from the sensors. An integrated multi-sensor module that uses differential sensors can measure a variety of localized ambient environmental conditions substantially simultaneously, and with a high level of precision. The multi-sensor module also features an integrated heater that can be used to calibrate or to adjust the sensors, either automatically or as needed. Such a miniature integrated multi-sensor module that features low power consumption can be used in medical monitoring and mobile computing, including smart phone applications.

主权项

1. A method of fabricating an integrated multi-sensor module on a single platform, the method comprising:
forming a layer of insulation on a silicon substrate; forming a metal interconnect structure above the layer of insulation, the metal interconnect structure including at least two patterned layers of metal separated by an inter-layer dielectric, in which vias are formed to establish electrical connections between the patterned layers of metal; forming an active sensor layer configured to sense environmental conditions; opening cavities in the active sensor layer; exposing the cavities to an ambient environment; and attaching a cap containing silicon over a portion of the active sensor layer, the cap having a window formed therein, the window aligned with the cavities so as to maintain exposure of the cavities to the ambient environment.