发明名称 Memory connection structure of storage device
摘要 A memory connection structure of a storage device is disclosed. The storage device includes a circuit board, a memory controller, a bus, and a memory module. The memory controller, the bus, and the memory module are electrically connected on the circuit board. The memory module is composed of a plurality of memory sockets and a plurality of volatile memories. The volatile memories are connected to the same bus via the corresponding memory sockets and connected to the memory controller via the bus. The bus has at least one connection point and each connection point is connected to two memory sockets. The circuit board has a front surface and a rear surface, and two memory sockets connected to the same connection point are correspondingly installed on each of the two surfaces of the circuit board. In addition, two distances between the each memory socket and the memory controller are identical.
申请公布号 US9251861(B2) 申请公布日期 2016.02.02
申请号 US201313870689 申请日期 2013.04.25
申请人 发明人 Liu Shu-Min
分类号 G11C5/06;H05K1/02 主分类号 G11C5/06
代理机构 Muncy, Geissler, Olds & Lowe, P.C. 代理人 Muncy, Geissler, Olds & Lowe, P.C.
主权项 1. A memory connection structure of a storage device, comprising: a circuit board having a front surface and a rear surface; the circuit board having a transmission interface thereon, and the storage device connected to an external computer motherboard via the transmission interface; a memory controller installed on the circuit board and electrically connected to the transmission interface via the circuit board; a bus installed on the circuit board and electrically connected to the memory controller via the circuit board; the bus having at least one connection point; a memory module installed on the circuit board and electrically connected to the bus via the circuit board; the memory module composed of at least two memory sockets and at least two volatile memories; the at least two volatile memories connected to the bus via the corresponding memory sockets; wherein each connection point of the bus is connected to the two memory sockets, and the two volatile memories are correspondingly accessed via the two memory sockets; the two memory sockets are correspondingly installed on the front surface and the rear surface of the circuit board, respectively, and a distance between the memory socket installed on the front surface and the memory controller is equal to a distance between the memory socket installed on the rear surface and the memory controller.
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