| 摘要 |
The present invention relates to a printed circuit board comprising: an insulating layer comprising an opening; a light emitting element which is embedded within the insulating layer and which comprises a light emitting part that is exposed through the opening; an encapsulation part which comprises a fluorescent substance and fills the opening; and a via which is formed on the insulating layer on the other side of the light emitting part of the light emitting element, and which is connected to a terminal of the light emitting element. |
