发明名称 LEAD FRAME, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING LEAD FRAME
摘要 A lead frame comprises a die pad and a plurality of leads arranged around the die pad. Each of the leads comprises an inner lead, a bent portion, and an external connection terminal. The inner lead comprises a distal portion, adjacent to the die pad, and a connection end portion, located at an end of the inner lead, opposite to the distal portion. The bent portion is connected to the connection end portion of the inner lead. The external connection terminal is connected to the connection end portion of the inner lead by the bent portion and located below the inner lead. The external connection terminal comprises an upper surface which faces and is parallel to a lower surface of the inner lead. The inner lead, the bent portion, and the external connection terminal are formed integratedly in each of the leads.
申请公布号 KR20160006608(A) 申请公布日期 2016.01.19
申请号 KR20150095231 申请日期 2015.07.03
申请人 SHINKO ELECTRIC INDUSTRIES CO., LTD. 发明人 HAYASHI SHINTARO
分类号 H01L23/495 主分类号 H01L23/495
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