| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which has favorable corrosion resistance and high heat resistance, and which allows reduction in manufacturing cost; and provide a manufacturing method of the semiconductor device.SOLUTION: A semiconductor device comprises: an external terminal 5; a first resin part 6 including a recess 10 arranged on an undersurface, an external terminal through hole 12 which penetrates from the recess toward a top face and through which the external terminal 5 is inserted, a resin injection hole 11 which penetrates from the top face toward the recess, and an air vent port 13 which penetrates from the recess to the top face; an insulation circuit sheet 7 which has an insulation sheet part 7a arranged on a bottom face 10a of the recess and a first circuit part 7b arranged on a surface of the insulation sheet part 7a opposite to the bottom face 10a of the recess, and which does not block the resin injection hole 11 and the air vent port 13; an insulation circuit board 1 which includes a second circuit part 1b on a top face of an insulating plate 1a and a metal plate 1c on an undersurface of the insulating plate 1a, and which is arranged in the recess; a semiconductor chip 2 electrically connected to the first circuit part 7b and the second circuit part 1b; and a second resin part 8 filled in the resin injection hole 11, the recess 10 and the air vent port 13. |
