Semiconductor device including embedded controller die and method of making same

摘要

A semiconductor device includes a substrate (102) with a cavity (112) formed therein for receiving a semiconductor die. In examples, the semiconductor die is a controller die (114). The controller die (114) may be electrically connected to the substrate (102) with electrical traces (120) which may be formed for example by printing. After the controller die (114) is electrically connected to the substrate (102), one or more memory die (150) may be affixed to the substrate (102), over the cavity (112) and controller die (114).

主权项

1. A semiconductor device, comprising:
a substrate including a dielectric layer and a conductive layer on the dielectric layer, the conductive layer including a conductance pattern including electrical traces and contact pads; a solder mask layer formed on the substrate over the conductive layer; a cavity formed in the substrate, down through the solder mask layer to a surface of the substrate on which the solder mask layer is formed; a first semiconductor die mounted in the cavity, electrically isolated on the dielectric layer, the first semiconductor die including die bond pads; the electrical traces formed between the contact pads of the substrate and the die bond pads of the first semiconductor die to electrically connect the first semiconductor die to the substrate; and a second semiconductor die mounted on the substrate, covering at least a portion of the cavity including the first semiconductor die.