| 摘要 |
The present invention relates to a conditioner of a chemical mechanical polishing apparatus, comprising: an arm extending from a center of rotation, and rotating in a reciprocating manner; a conditioning unit rotated by being connected to a driving shift which is rotated in an end portion of the arm, and micro cutting a surface of a polishing pad while pressurizing the polishing pad by holding a conditioning disk on a bottom surface; and a magnetic installed to apply a magnetic force toward a direction for inhibiting that the conditioning unit moves in a gravity direction. By holding the conditioning unit in the opposite direction of gravity by the magnetic force of the magnetic, the conditioner of a chemical mechanical polishing apparatus can reform the polishing pad by pressure which is lower than the weight of the conditioning unit while pressurizing and delicately controlling the polishing pad. |
