| 摘要 |
A module board (2) is provided with, e.g., insulating layers (3A to 3C), ground electrodes (4A to 4D), signal electrodes (5A to 5D), and interlayer via holes (6A to 6C) and (7A to 7C). On a surface of the module board (2), an electronic component (8) is mounted, and a seal resin layer (9) is formed to cover the electronic component (8). On the module board (2) is formed a half-cut portion (10) which is located toward an outer peripheral edge and recessed halfway in a thickness direction. On the module board (2) is formed a shield layer (11) to cover the seal resin layer (9). The shield layer (11) is provided with a frame portion (11B) extending into the half-cut portion (10). The frame portion (11B) is electrically connected to grounding interlayer via holes (6A, 6B) that are exposed on an end surface (10A) and a bottom surface (10B) of the half-cut portion (10). |
