| 发明名称 |
Flip-Chip Light Emitting Diode Assembly With Relief Channel |
| 摘要 |
A flip-chip LED assembly with relief channel and a method for making the flip-chip LED assembly is disclosed. In one embodiment, the flip-chip LED assembly includes a flip-chip LED with a via and a channel formed in the surface of the flip-chip LED. The channel extends from the via to a sidewall of the flip-chip LED. In another embodiment, a plurality of vias and a plurality of channels are formed in the surface of the flip-chip LED. Each of the plurality of channels extend from each of the vias to another via, or to a sidewall of the flip-chip LED. |
| 申请公布号 |
US2015364651(A1) |
申请公布日期 |
2015.12.17 |
| 申请号 |
US201414303201 |
申请日期 |
2014.06.12 |
| 申请人 |
Toshiba Corporation |
发明人 |
Zhao Wei;Chuang Chih-Wei;Lin Chao-Kun;Liu Kai |
| 分类号 |
H01L33/38;H01L33/00 |
主分类号 |
H01L33/38 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A light emitting diode (LED) assembly comprising:
an LED comprising:
a light emitting layer disposed between layers of different conductivity types;a via formed in the LED through the light emitting layer; a carrier bonded to the LED; and a channel formed in the LED extending from the via to a sidewall of the LED, the channel exposed at an upper surface of the LED. |
| 地址 |
Tokyo JP |
