| 摘要 |
An integrated circuit package system is provided to improve yield of a circuit system and reliability, and to reduce production costs due to a simplified manufacturing process. An integrated circuit package system(100) comprises: mounting a device structure(108) over a package carrier; connecting an internal interconnect between the device structure and the package carrier; forming an interconnect lock(104) over the internal interconnect over the device structure with the interconnect lock exposing the device structure; and forming a package encapsulation adjacent to the interconnect lock and over the package carrier. |
