发明名称 |
METHOD OF MANUFACTURING PIEZOELECTRIC VIBRATION PIECE, AND PIEZOELECTRIC VIBRATION DEVICE |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a piezoelectric vibration piece capable of reducing cost, and stabilized in frequency. <P>SOLUTION: The method of manufacturing a piezoelectric vibration piece forming a piezoelectric vibration piece having a target vibration frequency from a piezoelectric wafer comprises: an outline formation step S112 of forming the outline of the piezoelectric vibration piece at a frequency higher than a target vibration frequency; a first metal film formation step S120 of forming a first electrode film on a surface of the piezoelectric vibration piece with the outline formed; a first metal film thickness adjustment step S122 of adjusting the thickness of the first electrode film to be set at a first vibration frequency; and a second metal film formation step S132 of forming a second electrode film on the adjusted first electrode film, and setting the piezoelectric vibration piece at a second vibration frequency. <P>COPYRIGHT: (C)2009,JPO&INPIT |
申请公布号 |
JP2009088724(A) |
申请公布日期 |
2009.04.23 |
申请号 |
JP20070252875 |
申请日期 |
2007.09.28 |
申请人 |
NIPPON DEMPA KOGYO CO LTD |
发明人 |
TAKAHASHI TAKEHIRO |
分类号 |
H03H3/04;H01L41/09;H01L41/18;H01L41/22;H01L41/23;H01L41/253;H01L41/29;H01L41/332;H03H3/02;H03H9/19 |
主分类号 |
H03H3/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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