| 发明名称 |
SEMICONDUCTOR MOUNTING BONDING WIRE |
| 摘要 |
There is provided a bonding wire which does not cause a leaning failure or the like. A semiconductor mounting bonding wire has a breaking elongation of 7 to 20%, and stress at 1% elongation is greater than or equal to 90% of a tensile strength and is less than or equal to 100% thereof.
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| 申请公布号 |
US2009072399(A1) |
申请公布日期 |
2009.03.19 |
| 申请号 |
US20080146792 |
申请日期 |
2008.06.26 |
| 申请人 |
NIPPON STEEL MATERIALS CO., LTD.;NIPPON MICROMETAL CORPORATION |
发明人 |
TERASHIMA SHINICHI;UNO TOMOHIRO;TATSUMI KOHEI;YAMADA TAKASHI;IKEDA ATSUO;ODA DAIZO |
| 分类号 |
H01L23/49 |
主分类号 |
H01L23/49 |
| 代理机构 |
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代理人 |
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| 主权项 |
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