发明名称
摘要 PROBLEM TO BE SOLVED: To remove a residue of a resin composition in desmearing treatment, etc., even if the resin component is in uncured or semicured state. SOLUTION: A plasma discharge is generated with a counter electrode 1 and a power source 4, etc., under a pressure condition not to cause the evaporation of the uncured or semicured resin, especially near the atmospheric pressure and the residue of the resin composition of the treating object S is removed by the active species in the discharge. The resin composition residue can be removed even in a state of uncured or semicured resin component. The speed of the removing treatment is remarkably increased by performing the discharge treatment when the resin component is in the uncured or semicured state. COPYRIGHT: (C)2004,JPO
申请公布号 JP4217045(B2) 申请公布日期 2009.01.28
申请号 JP20020284101 申请日期 2002.09.27
申请人 发明人
分类号 C08J7/00 主分类号 C08J7/00
代理机构 代理人
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