| 摘要 |
PROBLEM TO BE SOLVED: To provide an inexpensive, good-thermal-conductivity metal base circuit board which has an aluminum or copper base plate (heat sink) as a circuit substrate for mounting a power semiconductor element thereon, and also has a circuit metal substrate formed on an insulating resin layer formed on the base plate. SOLUTION: In the metal base circuit board, an alumina layer 2 is formed on an aluminum base plate 1, and a circuit aluminum plate 4 having a predetermined thickness is joined to the alumina layer 2 with an aluminum soldering material 3 disposed therebetween. Consequently, the metal base circuit board can be manufactured inexpensively and can have a good thermal conductivity. COPYRIGHT: (C)2008,JPO&INPIT
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