| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an adhesive film for chip lamination which makes it possible to laminate a semiconductor silicon chip without having to put a spacer separately, in order to keep a wiring interval between an upper chip and a lower chip with the same area, during laminating the chip. <P>SOLUTION: The adhesive film is a multilayer adhesive film comprising a three-layers structure which is provided with a thermoplastic phenoxy resin adhesion layer 5 containing an ultraviolet-curing low-molecular compound; and thermosetting epoxy resin adhesion layers 6 located in both sides of the adhesion layer. After providing compatibility to an interface between the thermosetting epoxy resin and the thermoplastic phenoxy resin, the adhesive film is manufactured by a method including a step of directly forming the phenoxy film with a high modulus of elasticity in the interior by ultraviolet curing. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
