| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device in which wires do not touch each other. <P>SOLUTION: The semiconductor device 1 comprises an island 10 having an upper surface S1 and a lower surface S2 which oppose each other, semiconductor chips 22 and 24 mounted to the upper surface S1 of the island 10, a lead terminal 30 connected electrically with the semiconductor chips 22 and 24 by a bonding wire 58, and a plurality of relay terminals 40 provided between the island 10 and the lead terminal 30. The plurality of relay terminals 40 include relay terminals 42 and 44. These relay terminals 42 and 44 are connected electrically by a bonding wire 54. <P>COPYRIGHT: (C)2008,JPO&INPIT |
