| 摘要 |
Disclosed is a dicing die-bonding film which has an excellent balance between a holding force during the dicing of a work and detachability upon the detachment of a chip-type work produced by the dicing together with the die-bonding film even when the work is thin. The dicing die-bonding film comprises a base material, a dicing film arranged on the base material and having an adhesive layer, and a die-bonding film arranged on the adhesive layer, wherein the adhesive layer comprises a polymer comprising an acrylic acid ester as the main monomer, a hydroxyl-containing monomer at a content of 10 to 30 mol% relative to the amount of the acrylic acid ester, and an isocyanate compound having a radical-reactive carbon-carbon double bond at a content of 70 to 90 mol% relative to the amount of the hydroxyl-containing monomer, and wherein the die-bonding film comprises an epoxy resin. |
