发明名称 Thick film photoresist composition and method of forming resist pattern
摘要 A negative thick film photoresist composition with improved alkali developability is provided. The composition comprises: (A) a resin component containing (a) from 61 to 90% by weight of a structural unit derived from a cyclic alkyl (meth)acrylate ester, and (b) a structural unit derived from a radical polymerizable compound containing a hydroxyl group, (B) a polymerizable compound containing at least one ethylenic unsaturated double bond, (C) a photopolymerization initiator, and (D) an organic solvent.
申请公布号 US7598014(B2) 申请公布日期 2009.10.06
申请号 US20040578398 申请日期 2004.11.18
申请人 TOKYO OHKA KOGYO CO., LTD. 发明人 WASHIO YASUSHI;SAITO KOJI
分类号 G03F7/00;G03F7/004;G03F7/033;G03F7/40 主分类号 G03F7/00
代理机构 代理人
主权项
地址
您可能感兴趣的专利