| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device that packages chips having different sizes and a different bonding pad positions and is suitable for sharing. <P>SOLUTION: The semiconductor device includes the chip 220 having a plurality of first leads 210 of a lead frame having a zigzag type finger 211 including first and second finger sections 212, 213 subjected to bending connection in a V shape mutually and a plurality of the bonding pads 222. One end of bonding wires 231, 232 is connected to a group of bonding pads 222 of the chip 220, and the other end is arbitrarily connected to one of the sets of the first and second finger sections 212, 213. The direction of the wire bonding forms a first angle with respect to the expansion direction of the set to which one of the first and second finger sections 212, 213 is connected, forms a second angle with respect to the expansion direction of the set to which one of the first and second finger sections 212, 213 is not connected, the bonding wires 231, 232 set so that the first angle becomes smaller than the second one. <P>COPYRIGHT: (C)2009,JPO&INPIT |
