| 摘要 |
A semiconductor device includes first underlying lines in an underlying wiring layer electrically connected to and shaped like a first semiconductor region, second underlying lines in the underlying wiring layer electrically connected to and shaped like a second semiconductor region, a first intermediate line in an intermediate wiring layer electrically connected to the first underlying lines, the first intermediate line including finger regions shaped like the first underlying lines, a coupling section to electrically interconnect the finger regions, a second intermediate line in the intermediate wiring layer electrically connected to the second underlying lines, the second intermediate line including finger regions shaped like the second underlying lines, and a coupling section to electrically connect the finger regions, a first overlying line in an overlying wiring layer electrically connected to the first intermediate line, and a second overlying line in the overlying wiring layer electrically connected to the second intermediate line. |
