| 摘要 |
PROBLEM TO BE SOLVED: To prevent crack occurrence in a circuit formation region in dicing while preventing oxidation and corrosion of a seal ring including a copper layer in the uppermost layer. SOLUTION: A copper wiring layer 114 becoming the uppermost layer of a seal ring 110 is formed in an interlayer insulation film 109 on a silicon substrate 101, and an aluminum wiring layer 141 covering its upper surface is formed. A plasma nitride film layer 121 is formed on the interlayer insulation film 109 and the aluminum wiring layer 141, and an opening 123 penetrating the plasma nitride film layer 121 is formed between a dicing region and the seal ring. The width of the aluminum wiring layer 141 is formed larger than that of the wiring layer 114. COPYRIGHT: (C)2011,JPO&INPIT
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