| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method and an apparatus for mounting an electronic component capable of improving the positional accuracy of a pressurizing mechanism for an electronic component arranged on a substrate. <P>SOLUTION: A semiconductor chip 11 is photographed with an image pickup camera 22f before completely compression-bonding the semiconductor chip 11, and after that, an operation of a second compression-bonding section 22 is executed depending on a result of recognition of the image pickup camera. In this way, a pressurizing operation of the semiconductor chip 11 can be executed for a multipiece substrate 10f after a pressurizing surface P of a second head 22a is parallelly moved to an exact opposite position for the semiconductor chip 11 arranged on the multipiece substrate 10f. Thus, the positional accuracy of the pressurizing surface P can be improved for the semiconductor chip 11. <P>COPYRIGHT: (C)2012,JPO&INPIT |
