| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate for mounting an electronic element, in which wrinkles on an electronic element mounting surface of the aluminum circuit layer that may occur in a thermal cycle can be prevented. <P>SOLUTION: A substrate (1) for mounting an electronic element includes an insulating substrate (11) provided on its at least one surface with a brazed aluminum circuit layer (12) provided with a mounted electronic element (18). A base material (20) of the aluminum circuit layer (12) is provided on its surface for mounting an electronic element with an integrally laminated high strength layer (21), and a tensile strength X(N/mm<SP POS="POST">2</SP>) of the high strength layer (21) and a tensile strength Y (N/mm<SP POS="POST">2</SP>) of the base material (20) satisfy a relationship of the form X/Y≥1.1. <P>COPYRIGHT: (C)2013,JPO&INPIT |
