发明名称 |
Predicting performance of an integrated circuit |
摘要 |
A method of characterizing a die can include correlating, using a processor, a static voltage profile of a die under test in wafer form with a plurality of test static voltage profiles. The plurality of test static voltage profiles can be associated with dynamic performance profiles. The method further can include predicting dynamic performance of the die under test according to the dynamic performance profile associated with a test static voltage profile that is correlated with the static voltage profile. |
申请公布号 |
US8712718(B1) |
申请公布日期 |
2014.04.29 |
申请号 |
US201113187251 |
申请日期 |
2011.07.20 |
申请人 |
CAMAROTA RAFAEL C.;FERGUSON DAVID L.;RICHMOND GEOFFREY;XILINX, INC. |
发明人 |
CAMAROTA RAFAEL C.;FERGUSON DAVID L.;RICHMOND GEOFFREY |
分类号 |
G01R31/00;G01R31/28 |
主分类号 |
G01R31/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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