| 发明名称 |
Flexible sized die for use in multi-die integrated circuit |
| 摘要 |
An integrated circuit (IC) structure can include a first die and a second die. The second die can include a first base unit and a second base unit. Each of the first base unit and the second base unit is self-contained and no signals pass between the first base unit and the second base unit within the second die. The IC structure can include an interposer. The interposer includes a first plurality of inter-die wires coupling the first die to the first base unit, a second plurality of inter-die wires coupling the first die to the second base unit, and a third plurality of inter-die wires coupling the first base unit to the second base unit. |
| 申请公布号 |
US9026872(B2) |
申请公布日期 |
2015.05.05 |
| 申请号 |
US201213587778 |
申请日期 |
2012.08.16 |
| 申请人 |
Xilinx, Inc. |
发明人 |
Camarota Rafael C. |
| 分类号 |
G01R31/28;H01L21/66;H01L23/14;H01L25/065;H01L23/498;H01L21/78 |
主分类号 |
G01R31/28 |
| 代理机构 |
|
代理人 |
Cuenot Kevin T.;Taboada Keith;Cartier Lois D. |
| 主权项 |
1. An integrated circuit structure, comprising:
a first die; a second die comprising a first base unit and a second base unit; wherein each of the first base unit and the second base unit is self-contained and no signals pass between the first base unit and the second base unit within the second die; and an interposer comprising a first plurality of inter-die wires coupling the first die to the first base unit, a second plurality of inter-die wires coupling the first die to the second base unit, and a third plurality of inter-die wires coupling the first base unit to the second base unit. |
| 地址 |
San Jose CA US |
