Molding Structure for Wafer Level Package

摘要

A method in which microelectronic devices are attached to a substrate surface, wherein spaces interpose neighboring ones of the microelectronic devices. Each microelectronic device has an outermost surface that is substantially parallel to the substrate surface. The substrate is closed in a transfer molding cavity of a transfer molding apparatus such that an internal surface of the transfer molding cavity contacts a substantial portion of each of the outermost surfaces of the microelectronic devices. A molding compound is subsequently injected into the transfer molding cavity, including into the spaces between ones of the plurality of microelectronic devices.

主权项

1. A method, comprising:
attaching a plurality of microelectronic devices to a surface of a substrate, wherein spaces interpose neighboring ones of the plurality of microelectronic devices, and wherein each of the plurality of microelectronic devices has an outermost surface that is substantially parallel to the substrate surface; closing the substrate in a transfer molding cavity of a transfer molding apparatus such that an internal surface of the transfer molding cavity contacts a substantial portion of each of the outermost surfaces of the plurality of microelectronic devices; and injecting a molding compound into the transfer molding cavity, including into the spaces between ones of the plurality of microelectronic devices.