| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To reliably divide a metal film on a wafer backside without causing breakage of a chip or misalignment of chips when breaking a laser modified semiconductor wafer on which the metal film is formed on the backside. <P>SOLUTION: A semiconductor wafer breaking apparatus comprises: frame fixing means fixing a work in which a semiconductor wafer, on which a metal film is formed on a backside and which is dicing processed along a preliminary formed segmentation schedule line into individual chips, is attached to a pressure sensitive adhesive sheet via the metal film and mounted on a ring-shaped frame; a squeegee with the center part being formed higher than both end parts in a longer direction; and an elevating and rotating mechanism rotating the squeegee around its center by pressing the squeegee to the pressure sensitive adhesive sheet so as to substantially match the center of the squeegee and the center of the semiconductor wafer. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
