半導体装置の製造方法、接続子、半導体装置及び整列治具,申请号JP20110279024-传众专利搜索

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发明名称	半導体装置の製造方法、接続子、半導体装置及び整列治具
摘要
申请公布号	JP5832885(B2)	申请公布日期	2015.12.16
申请号	JP20110279024	申请日期	2011.12.20
申请人	新電元工業株式会社	发明人	佐々木敦
分类号	H01L21/60;H01L21/50	主分类号	H01L21/60
代理机构		代理人
主权项
地址

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