基板及其制造方法;A SUBSTRATE AND THE METHOD TO FABRICATE THEREOF

摘要

本发明揭露一基板，该基板的侧表面之形成以露出至少一部分的导孔，用以电路连接。该基板包含复数个绝缘层和被该复数个绝缘层所分离的复数个导电层。 该基板的一第一侧表面藉由该复数个导电层和该复数个绝缘层所形成。该基板的该第一侧表面包含由一第一导电材料所填充之至少一第一部分的一第一导孔(via)。; and a plurality of conductive layers separated by the plurality of insulating layers. A first lateral surface of the substrate is formed by the plurality of conductive layers and the plurality of insulating layers. The first lateral surface of the substrate comprises at least one first portion of a first via filled with a first conductive material.