| 发明名称 | Semiconductor device | ||
| 摘要 | A semiconductor device includes a first chip mounting portion, a first semiconductor chip arranged over the first chip mounting portion, a first pad formed in a surface of the first semiconductor chip, a first lead which serves as an external coupling terminal, a first conductive member which electrically couples the first pad and the first lead, and a sealing body which seals a part of the first chip mounting portion, the first semiconductor chip, a part of the first lead, and the first conductive member. The first conductive member includes a first plate-like portion, and a first support portion formed integrally with the first plate-like portion. An end of the first support portion is exposed from the sealing body, and the first support portion is formed with a first bent portion. | ||
| 申请公布号 | US9214412(B2) | 申请公布日期 | 2015.12.15 |
| 申请号 | US201414304945 | 申请日期 | 2014.06.15 |
| 申请人 | Renesas Electronics Corporation | 发明人 | Funatsu Katsuhiko;Sato Yukihiro;Yato Yuichi;Uno Tomoaki |
| 分类号 | H01L23/495;H01L23/10;H01L23/00;H01L23/31;H01L21/56 | 主分类号 | H01L23/495 |
| 代理机构 | Miles & Stockbridge P.C. | 代理人 | Miles & Stockbridge P.C. |
| 主权项 | 1. A semiconductor device comprising: (a) a first chip mounting portion; (b) a first semiconductor chip arranged over the first chip mounting portion; (c) a first pad formed in a surface of the first semiconductor chip; (d) a first lead which serves as an external coupling terminal; (e) a first conductive member which electrically couples the first pad and the first lead to each other; and (f) a sealing body which seals a part of the first chip mounting portion, the first semiconductor chip, a part of the first lead, and the first conductive member, wherein the first conductive member includes: (g1) a first plate-shaped portion; and (g2) a first support portion formed integrally with the first plate-shaped portion, and (g3) a second support portion formed integrally with the first plate-shaped portion, wherein the sealing body seals the first support portion such that only a side surface of an end of the first support portion is exposed from a side surface of the sealing body, wherein the sealing body seals the second support portion such that only a side surface of an end of the second support portion is exposed from a side surface of the sealing body, wherein the first support portion is formed with a first bent portion, the first bent portion extending, in a plan view, from a side surface of the plate-shaped portion, and wherein the second support portion is formed with a second bent portion, the second bent portion extending, in a plan view, from a side surface of the plate-shaped portion. | ||
| 地址 | Tokyo JP | ||