ADHESION PROMOTER, CURABLE SILICONE COMPOSITION, AND SEMICONDUCTOR DEVICE

摘要

An adhesion promoter represented by an average formula; a curable silicone composition comprising at least (A) an organopolysiloxane having at least two alkenyl groups per molecule, (B) an organohydrogenpolysiloxane having, per molecule, at least two hydrogen atoms each having a silicon atom bound thereto, (C) the above-mentioned adhesion promoter and (D) a hydrosilylation reaction catalyst; and a semiconductor device in which a semiconductor element is sealed with a cured product of the above-mentioned curable silicone composition. Provided are: a novel adhesion promoter; a curable silicone composition which contains the adhesion promoter and can be formed into a cured article having excellent adhesion to various base materials; and an optical semiconductor device which is produced using the curable silicone composition and has excellent reliability.